Used NIDEC TOSOK ILB5210R-C #9393473 for sale

NIDEC TOSOK ILB5210R-C Bonding equipment is a state-of-the-art surface mount technology (SMT) bonding machine. It is designed to meet the high quality and productivity needs of even the most demanding semiconductor, automotive, medical, and telecommunications industries. ILB5210R-C can be used for a variety of applications, including multiple types of soldering, bonding and attachment processes. NIDEC TOSOK ILB5210R-C is driven by a FPC motion control system. It employs direct drive and dedicated module for full-clutch control, providing superior motion control and smooth linear motion. The machine features a 4-axis gantry stage with a processing area of 800mm x 600mm and capable of handling components up to 50mm in size. The four-axis gantry specs also help reduce cycle time and improve process accuracy. The ILB5210 unit features a Programmable Logic Control (PLC) machine to provide precise, accurate automated assembly and inspection. This feature enables the machine to handle complicated bonding processes easily and accurately. ILB5210R-C also has vision capability, adding an extra layer of accuracy and quality control. This vision capability is often used for inspecting product size, shape, orientation, and dimensional accuracy. NIDEC TOSOK ILB5210R-C is capable of providing a variety of controlled temperatures ranging from 150-350°C. This allows the machine to handle a variety of thermally-sensitive materials while providing users with superior accuracy and quality. Furthermore, ILB5210R-C has a user-friendly 10.4-inch touchscreen display. This tool makes operation and progamming of this machine highly intuitive and efficient. Finally, NIDEC TOSOK ILB5210R-C is a highly reliable asset with a long work cycle life and low maintenance cost, resulting in high product yields and consistent quality. The model employs an on-board nitrogen generator to further ensure product quality and reduce contamination. ILB5210R-C is the ideal choice for those looking for an intuitive and efficient SMT bonding equipment with precision and accuracy.