Used NORDSON / DAGE 4000 PLUS #293600641 for sale

NORDSON / DAGE 4000 PLUS is a highly automated bonder designed for use in the production of microelectronic components such as semiconductor packages, integrated circuit packages, and flip chips. It offers high accuracy, repeatability and cost efficiency for all types of high volume bond production. DAGE 4000 PLUS features a die bonding equipment utilizing NF4x4 bond systems and incorporation of an intuitive "plug and play" configuration. This system makes operation and set up quick and easy. The bonder is equipped with a high-performance heating unit, ensuring precise temperature and time control during the entire process. The heater also utilizes a non-contact heat and air cooling machine that eliminates the need for physical contact between the die and the heater. This feature increases the accuracy of the bonding process and reduces the risk of damage to the die. The machine is also capable of performing delicate and exacting operations such as flip-chip bonding. This process requires extremely precise placement of the die on the package. NORDSON 4000 PLUS bonder features a alignment tool that ensures accurate placement of the die with a precision of 10 microns. In addition, the machine has an intuitive user interface and control asset which allows for easily programmable set up and operation. The machine is also equipped with a software library containing a wide variety of pre-programmed algorithms that facilitate quick and easy process development. 4000 PLUS is a powerful and user friendly bonder that is perfect for high volume production of microelectronic components. Its precision, accuracy and cost efficiency provide users with a highly reliable and cost effective method of producing high quality components.