Used NORDSON / DAGE 4000P #9280869 for sale

The NORDONNORDSON / DAGE 4000P is a fully automated, computer-controlled precision bonder designed for a variety of wafer and die-attach tasks. This bonder provides superior ultra-fine pitch die attach accuracy and repeatability enabling attachment down to 0.3mm pitch, utilizing standard water-soluble soldering paste. This machine is one of the most advanced systems available on the market, providing reliability and speed for efficient yields. The NORDONDAGE 4000P utilises an integrated vision equipment for accurate vision alignment over a wide range of components, capable of inspecting and measuring the height, width, and pitch of multiple parts. This advanced system incorporates a XY-Galvo scanner which enables superior placement accuracy while reducing contamination effects. The NORDONNORDSON 4000P boasts a unique dual arm wafer handler, a hot air reflow unit, an auto-unload mechanism, and a two-zone temperature controller. This combination allows for precise placement and heating of components, with a choice of programmable reflow temperature profiles for improved finished quality. The NORDON4000P is loaded with connectivity features for fast and reliable transfer of data and components. It offers Ethernet, RS232, and USB interfaces as well as an optional device server allowing remote access to the machine. An Multi-Alignment feature enables users to store as many as 10 relative alignments so that when attaching components, any misalignment will be automatically corrected after a single pass. The NORDONNORDSON / DAGE 4000P also offers a precise bond head control machine that enables extended downtime between maintenance cycles, a wafer debonder feature for the precise removal of soldered parts, and a range of interchangeable bonding tips to suit various sizes and shapes of components. Overall, the NORDONDAGE 4000P is a reliable, high speed, precise bonder designed for both high accuracy and repeatability in bonder applications. Its comprehensive range of features and connectivity options make it the ideal choice for wafer and die-attach operations in the semiconductor industry.