Used NTS NBM-SE-10 #9394998 for sale

NTS NBM-SE-10 is an optoelectronic bonder based on an advanced Non-Contact Thermocompression technique. It is a solid state bonder with no moving parts, with a downward pressing force of up to 10N (Newtons), making it ideal for thermocompression bonding of a variety of materials. The high degree of accuracy and stability makes it perfect for bonding wires, LEDs, diodes, chips, substrates and many other components. NTS NMB-SE-10 is designed for automated production, offering excellent packaging and long service life. This machine features an ergonomic design, with an intuitive operator interface that allows for setting of different parameters that control the bonding process for different materials. The user can set the temperature of the die and the amount of pressure applied during the bonding process, ensuring an optimal bond every time. The machine also features an advanced feedback loop for controlling force and temperature, allowing for precise adjustment of the boding parameters. This system uses an advanced array of optical and vision components to locate and track the bond join during the bonding process. The onboard vision system ensures maximum accuracy and repeatability of the bonding process, giving a reliable and consistent bond. In addition, the system allows for the use of different positioning strategies, enabling accurate and repeatable alignment of bond positions and shapes. NBM-SE-10 is provided with a range of tools that allow for improved accuracy and consistency in the bonding process. These tools include an auto-focus camera for positioning of the bond join, an array of LED lights to assist in locating the bond join, an intuitive user interface for setting parameters, and a range of force and temperature probes that give feedback on the bond process. NTS NBM-SE-10 also features a range of safety features, such as an emergency stop button, auto-disconnection of feed lines, and an integrated safety circuit. The safety circuit includes a range of sensors that monitor the machine's temperature, voltage, and force, ensuring that the machine is operating within the safety limits and ensuring optimal performance. Overall, NBM-SE-10 is a highly reliable and efficient optoelectronic bonder, perfect for thermocompression bonding of a range of materials, offering exceptional accuracy and repeatability. With its intuitive user interface and a range of additional features, this machine is an ideal choice for automated production, offering long service life and excellent value for money.