Used NTS NBM-SE3-4 #9248790 for sale

NTS NBM-SE3-4 is an automated bonder designed to ease the bonding process in the electronics assembly field. The assembly field often requires a lot of precision and care and this bonder has been designed with this in mind. As far as technical specifications go, NBM-SE3-4 bonder has an active bond area of 3''x4'' so it can accommodate larger components such as SOIC and TQFP packages as well as flip chips and leaded components. It runs on a single-phase VAC via a transformer and has a single-head pneumatic bonding system with an integrated actively controlled thermocouple for temperature control. This feature allows accurate temperature regulation and is especially useful when bonding components with low thermal mass. NTS NBM-SE3-4 is compact and easily transportable, allowing it to be used in many different work settings. It is capable of handling both epoxy die attach and wire bonding applications with a range of pressure and speed to provide operators with a high degree of control. Furthermore, it is equipped with multiple process parameters, allowing operators to preset each parameter for a particular process. NBM-SE3-4 bonder boasts additional features such as a built-in video camera to monitor the alignment of the components and an auto-calibration function for XY, tilt and rotation. This bonder also provides vibration dampening using its three-axis ball screw drive system, reducing operator fatigue, as well as proving consistent surface pressure. Overall NTS NBM-SE3-4 bonder is a reliable and highly functional automatic bonder for the electronics assembly field. With its variety of features, it is user-friendly and designed to ensure accuracy and speed throughout the bonding process. It is a great addition to any electronic assembly process and is sure to bring high-quality results to producers.