Used NTS NFB-4150 #293597243 for sale

NTS NFB-4150 Bonder is a semi-automatic ceramic chip bonder intended for general purpose wafer bonding needs. It is a multi-functional, modular system that can be used to bond virtually any type of ceramic (including gold, aluminum, copper and phosphor bronze) chip. NFB-4150 utilizes a high-powered automatic stage with precision steely-tip tip shuttles that move the bonding area quickly and accurately. The stage has linear travel in the X, Y and Z directions, allowing for programmable and repeatable bond positions. It also features a low, uniform thermal profile to minimize temperature cycling and minimize thermal stress. An LED display and touch-screen user interface make NTS NFB-4150 easy to use and control, allowing for quick setup and operation. NFB-4150 is designed to bond chips on a variety of substrates, including silicon and ceramic components. The machine supports single chip, multi-chip and stacking bond operations. It is equipped with two cleaving lugs, two side flipping lugs and an adjustable epoxy nozzle, enabling it to adjust the chip placement and reach small features and tight corners. The machine also features an integrated video system for magnifying the bonding area and can be connected to an external imaging system for inspecting samples. NTS NFB-4150 is a cost-effective and reliable ceramic chip bonding solution. It is ideal for chip-on-chip, stacked die, and flip-chip bonding operations. With its multi-functionality, precision control and advanced capabilities, NFB-4150 is an excellent choice for businesses that require quality and reliable chip bonding at an affordable price.