Used OHASHI CAJR-01 IC #9009466 for sale

OHASHI CAJR-01 IC Bonder is a state of the art machine that automates the precision bonding process for integrated circuit (IC) chips. Developed in Japan, it offers a reliable, long-term solution to high-accuracy bonding needs. The machine features a fully automated control equipment that requires minimal human intervention, making it perfect for high-volume operations requiring constant production. It is also capable of accurately performing small-scale precision bonding and welding, allowing for a wide variety of applications. CAJR-01 IC Bonder offers a robust design that ensures an efficient and precise performance. It utilizes a continuously variable speed drive system to ensure constant lower-power operation with little or no variation, resulting in a more consistent welding process. The machine also features an advanced thermal control unit with high-accuracy temperature regulation and a quick setup process. This ensures that each cycle is accurate and repeatable. OHASHI CAJR-01 IC Bonder is equipped with a robust platform for connecting multiple bonding tools and delivers a fully integrated tooling software package for easy operations. It is capable of perfor ming complex joining operations like tape automated bonding (TAB), wire bonding, and thermocompression bonding in single or series production operations. It is also ideal for CSP and flip chip bonding. CAJR-01 IC Bonder also offers an intelligent control machine that minimizes manual programming and allows for quick verification processes. This helps to streamline the production process, saving time and cost. The monitoring tool offers data logging and visualization functions, helping to ensure quality assurance throughout operations. Overall, OHASHI CAJR-01 IC Bonder offers exceptional precision, accuracy, and consistency in a reliable, long-term package. Its robust design and thermal control asset ensure maximum efficiency and precision. With its flexible and integrated tooling, it is perfect for a wide variety of applications. The intelligent control model limits setup times while also allowing for quick quality assurance processes. For any bonding application, CAJR-01 IC Bonder is a top choice.