Used OHASHI CBM-2020CSSDNK #9210998 for sale
URL successfully copied!
Tap to zoom
ID: 9210998
Vintage: 2009
Chip bonding machines
Process type: Main bonding
Box: 1075 (D)
Patrites: 2000 (H)
Work size (PCB):
Minimum: 20 x 20 mm
Maximum: 142 x 230 mm
Work thickness:
Component height:
Maximum: 10 mm
FR4: (8) Layers substrate
Work handling: Manual loading & unloading by operator
Carrier size: 250 (X) x 400 (Y) x 10 (T) mm
Performance:
Bonding accuracy: ± 10 µm (X / Y Axis)
Machine cycle time: Bonding time + 8 sec / Head qty
Average determined with sample, N: 50
Utilities:
Compressed air supply: Dry air
0.5 Mpa 250 L / Minute peak draw (8 mm air tube)
Vacuum supply: Internal vacuum ejector machine
Cleanliness: Class 1000
Humidity: 50% ± 20% RH
Exhaust: Air tube, 8 mm
ESD Control:
Meet ANSI / ESD2020
Less than 100 V
Electric supply: AC 200-220 V, 3 Phase, 50/60 Hz, 30 A
2009 vintage.
OHASHI CBM-2020CSSDNK is a two-part bonder specifically designed for the bonding of delicate components. This bonder combines a flexible, air-driven heated base with a low-vibration, brushless motor spindle. The heated base ensures a precise and uniform bonding temperature for intricate bond seams, eliminating the need for manual heat-control. The brushless motor spindle provides low-vibration operation for delicate components, allowing for optimal bonding levels without the fear of breakage. CBM-2020CSSDNK has a powerful and precise spindle for controlled trim cutting. The motor has a maximum speed of up to five (5) revolutions per minute, allowing for the highest precision levels while the spindle maintains low-vibration operation. OHASHI CBM-2020CSSDNK is also able to accurately trim excess material, providing a clean cut without negatively impacting the component being trimmed. CBM-2020CSSDNK is the ideal bonding system for high-precision applications. The bond seam is designed to handle both pressure and thermal applications, allowing for the bonding of delicate materials such as lead and tin alloys without the fear of breakage. The low-vibration operation, coupled with a precise air-driven heated base, ensures a precise and reliable bond is achieved. Overall, OHASHI CBM-2020CSSDNK is an excellent choice for delicate component bonding. The air-driven heated base and low-vibration, brushless motor spindle provide precision, reliability, and optimal bond durability. The precise and reliable spindle also allows for accurate trim cutting, providing a clean cut with no damage to the underlying component. This makes CBM-2020CSSDNK an excellent choice for precise and delicate component bonding.
There are no reviews yet