Used ORTHODYNE 20 #2537 for sale

ORTHODYNE 20 is the latest bonder from ORTHODYNE family of bonding products. It is a highly reliable, fully automated inline bonder used for high yield ultra fine wire bonding applications. The system is designed to provide stable, highly repeatable and accurate bonds at speeds up to 100,000 bonds per hour. It utilizes an advanced motion control platform which can handle up to 6 different bonding motions in order to achieve the highest yields and bond quality. 20 bonder is built with a number of sophisticated features, such as minimized power consumption, an advanced anti-static loop, and a patented clamping feature that helps prevent wire breakage. The system can also be customized with a variety of options to suit an array of applications, including an automated wire feeder and an upper bond head. The system also features a large 7.8 inch color touch screen, which displays a series of simple and intuitive command prompts for easy configuration settings. This touch screen can also be used for monitoring bond detailing as well as for setting bond lengths, spacing and positions. The touch screen also allows for further customization by enabling operators to adjust the speed, stability and accuracy of bonds. ORTHODYNE 20 contains an automated ball pick-up feature which facilitates quick and easy manipulation of fine wire ball diameter and feature depth. In addition, its high accuracy position accuracy ensures perfect alignment and calculation of heat time and pressure in a single bond cycle. The bond parameters are controlled just before each bonding process starts, providing reliable and highly repeatable results. 20 incorporates the highest quality and advanced features for efficient and highly reliable bonding. Thanks to its versatile capabilities and user friendly interface, this machine is suitable for a wide variety of applications including die attach and flip chip technologies, as well as for a range of other ultra-fine wire bonding applications.