Used ORTHODYNE 20 #83665 for sale

ORTHODYNE 20 Bonder is a reliable and precise automated die-bonding instrument suitable for a wide range of advanced applications. This die-bonding equipment can accomplish precise and repeatable thermosonic and thermosonic/steady state wire bonding with its embedded vision system, while offering customers a cost-effective solution. 20 utilizes a die-bond head manufactured with precision to the highest quality standards, ensuring a consistent and reliable bond quality. The vision unit used by ORTHODYNE 20 is capable of aligning the die to the perfect bonding site with an accuracy of +/- 2µm. This accuracy is further supported by the die-bond head's ability to move in both X and Y axes with a resolution of 0.25µm. 20 offers a variety of bonding choices including thermosonic gold wire, thermosonic aluminum wire, thermocompression gold wire, and thermocompression aluminum wire. This flexibility allows the user to select the ideal bonding method for their particular needs when practicality and cost are considerations. ORTHODYNE 20 allows for rapid wire bonding by automatically detecting the tip of the wire as it is placed in the die-bond head. This machine also allows for a repeatable process as the die-bond head can return to the same location for each batch of wires. The vision tool also helps to reduce wire loop height variations and open wire loops. In addition to its robust stability, 20 possesses a number of safety features, enabling operators to maintain a clean and safe working environment. This asset incorporates a two-stage power fail protection, preventing additional damage to any components due to improper power supply. Safety features include sheath-safety glove covering all controlling elements, as well as pressure and temperature limits switch, all to safeguard from any potential harm to the operator or the environment. Overall, ORTHODYNE 20 is an ideal die-bonding instrument for customers requiring a precise, repeatable and cost-effective solution for their thermosonic and thermocompression wire bonding needs.