Used ORTHODYNE 20 #9254583 for sale

ORTHODYNE 20 is a state of the art polyimide bonding and encapsulating equipment designed to protect components and circuits. It is a two-component system with a range of applications, which provide reliable and reliable insulation of circuits and components. 20 unit is designed for use in extreme temperature environments, up to 200°C. This is achieved with its epoxy based formulation that exhibits superior adhesion even under high temperatures. The low viscosity and high solids content of the polyimide-based adhesive ensure excellent electrical insulation. The machine also offers excellent surface protection, with strong chemical resistance to oil, dust, and moisture. The material applied by ORTHODYNE 20 is resistant to abrasion and shock, providing highly reliable protection for electronics over a long operating lifetime. The two-component tool features an easily activated catalyst that facilitates fast curing and strong bonds. It allows for accurate mixing with quick curing times, making it ideal for fast-paced production lines. It is self-leveling in nature, providing simple and effective encapsulation without a mess. 20 is also compatible with a range of plastics and metals, including aluminum and brass. ORTHODYNE 20 can be applied either manually or with automatic dispensing machinery. It is well suited to fine line and applied to a wide range of electronic components, including ball grid arrays, flex circuits, and connectors. It exhibits low bleed, ensuring that the component surface remains free of flux residue. The cured encapsulate shows good dielectric strength, for reliable long-term insulation even in high-frequency applications. 20 has proven to be a reliable, cost-effective bonding and encapsulating asset for providing reliable protection in extreme temperature environments. This two-component model shows excellent curing, electrical insulation, and chemical resistance and provides simple and accurate applications, making it ideal for fast-paced production lines. The superior adhesion and self-leveling properties make it well suited for a wide range of components, ideal for use in a variety of electronic applications.