Used ORTHODYNE 20B #49104 for sale

ORTHODYNE 20B is an automated semi-conductor bonder that uses ultrasound technology to seal the gap between bonding pads on integrated chips. It is ideal for automated assembly line production to ensure quality, precision and repeatability. The machine's flexible design and advanced control panel allow users to easily adjust settings to suit their particular application while attaining high soldering yields. 20B is capable of bonding a large variety of metals including aluminum, copper, brass and silver. Its advanced Ceramicshell design provides excellent temperature control to reach optimal bonding temperature quickly and accurately. Ultrasonic welding vortex technology is used in the bond process to create strong, uniform connections between on-board pads. The use of this technology reduces fatigue in the structural integrity of the soldered components. Additionally, ORTHODYNE 20B's powerful software offers a range of functionalities to simplify the bond process from material selection to post-soldering inspection. 20B also features an innovative chip alignment equipment that detects and compensates for misalignment of integrated chips. This system ensures a precise and reliable bond regardless of the chip's dimensions or complexity. In addition, the Focused Acoustic Ultrasonic beam is variable and allows for varying levels of acoustic power to be targeted at the specific area for bonding. This allows for optimized bonding performance at the particular operating temperature. ORTHODYNE 20B's compact footprint and easy to use controls allow users to quickly move between different jobs and easily adjust settings according to their bonding needs. Furthermore, the unit is designed to be low maintenance and utilizes standard consumables thus reducing production costs. 20B also enables manufacturers to achieve advanced results with minimal environmental impact; the machine follows strict environmental guidelines and has LEED certification. Overall, ORTHODYNE 20B is an advanced, flexible semi-conductor bonder ideal for automated assembly line production. It is capable of trustworthy bonding and minimizes the environmental impacts associated with the bonding process. Its user friendly controls and white glove technical support make it a highly sought after solution for most semi-conductor needs.