Used ORTHODYNE 3600 Plus #293803611 for sale

A ORTHODYNE 3600 Plus is a high performing resistive bonder and die bonder that is designed for multi-inquiry and free-form multi-chip modules. It provides an excellent solution for high performance chip-to-chip semiconductor manufacturing applications. The key features of this bonder are its high speed and accuracy, along with its wide range of parameters for variable thickness and surface properties. 3600 Plus has a built-in test monitor for real time diagnostics, which allows for quick and accurate troubleshooting. This is the perfect equipment for those who need precise and fast process times. ORTHODYNE 3600 Plus has two independently programmed application platforms which allow for the simultaneous bonding of up to two different types of component and substrate. It also features an array of transformers to suit any application requirement. The machine is equipped with a high-end robotic system, allowing for intuitive re-programming and remote monitoring. The unit is designed with fault-tolerant and repeatable algorithms, reducing human errors and lowering manufacturing costs. 3600 Plus comes with a wide range of features, allowing for optimal overlap, high service temperature cycle accuracy, and fine pitch alignment control. The state-of-the-art motion control machine features adjustable speed, as well as the ability to switch speed in application program. This allows precision control for demanding applications. The bonder has advanced vision inspection capabilities that allow it to accurately recognize fiduciary marks, which gives it the advantage of easy tracking, full control, and extensive documentation. It also provides excellent consistency for high-attribute, difficult to assemble components. ORTHODYNE 3600 Plus has a robust tape feeder tool, which gives it the ability to perform die attach and wirebond jobs. This means less downtime, and fast and reliable production cycles. It has a quick exchange tool asset, as well as a range of optional accessories that can be integrated with its main module, including pneumatic CCDs, force/torque sensors, and 3D image processing systems. Overall, 3600 Plus is a reliable and high-performance resistive bonder and die bonder. It is designed to provide the highest precision in the most demanding semiconductor manufacturing applications. With its intuitive controls and user-friendly interface, it ensures accurate and consistent results every time.