Used ORTHODYNE 360C #293823768 for sale

ORTHODYNE 360C Bonder is a high-efficiency automated bonding system for fully automated production of large-scale printed circuit board (PCB) assemblies with high-occupancy components. It is capable of automated multi-site bonding of components such as chip capacitors, resistors, SIPs, and BGA packages with ultra-exact positioning of connections. 360C Bonder is equipped with sophisticated vision and alignment system which is capable of identifying components with precise accuracy, enabling precise positioning of components and precise placement and bonding of components with minimal input from the operator. It has precise machine control with precise positioning and advanced software for accurate program setup. ORTHODYNE 360C can be configured to work with a wide range of materials and components in sizes ranging from 0.5mm pitch to 64mm pitch. The machine features pre- and post-dispensing diagnostics which enable it to continuously monitor the quality of the dispensed material, ensuring a consistent quality of the assemblies. It is equipped with monitoring tools which allows a quick overview of all processes associated with the dispensing assembly and a set of dispense parameters, allowing greater control and adjustment of the dispensing process. 360C Bonder is a user-friendly piece of equipment that provides a secure connection of components, reducing soldering errors and increasing production rates. Its high accuracy, repeatability and exacting control ensure consistent and reliable results for all applications. This fully automated production system allows for higher accuracy, higher quality and higher throughput than manual systems. It is suitable for a wide range of applications including those requiring high accuracy, repeatability, and high throughput.