Used ORTHODYNE 360C #293827823 for sale

ORTHODYNE 360C is a high-performance bonder designed for efficient and reliable wire bonding of semiconductor components. Featuring a Windows-based Human Machine Interface (HMI), 360C provides an easy-to-use, intuitive control equipment for setup, configuration, and operation. The machine is capable of operating in a variety of bonding modes, including C-wedge and ball wedge, and can bond wires as thin as 0.0003-inch (75μm) in diameter. ORTHODYNE 360C offers a controlled thermal environment within its Bond Chamber, ensuring consistent temperature distribution throughout the bonding operation. This helps to ensure reliable bonding results and repeatability over multiple cycles. The high-precision and high-torque motors of the bonder also provide stability for smooth, reliable operations, and can be easily configured for accurate and repeatable performance. 360C includes a built-in, high-resolution vision system that helps facilitate defect detection and automates wire and component inspection. This helps reduce operator intervention, conserve production time, and improve process yield. The unit also features a wide range of editable program variables and is capable of auto-sensing bond type, wire size and bond parameters. An intuitive touchscreen allows easy control and access of all relevant process parameters. ORTHODYNE 360C is designed with a small footprint and integrated delivery systems, making it suitable for most production environments. The intuitive user interface, advanced vision machine, easy-to-use software, and multiple bonding modes make 360C an excellent choice for semiconductor wire bonding operations.