Used ORTHODYNE 7200 Plus #9402566 for sale

ORTHODYNE 7200 Plus
Manufacturer
ORTHODYNE
Model
7200 Plus
ID: 9402566
Vintage: 2006
Wire bonder 2006 vintage.
ORTHODYNE 7200 Plus is a high-level bonder designed to align and accurately bond PCBs. Its features make it ideal for both low and high-volume production manufacturing needs. 7200 Plus is designed to help optimize flow and productivity, reduce scrap costs and increase yield. ORTHODYNE 7200 Plus has a fast throughput to accommodate large production runs, and its placement accuracy ensures that components are placed correctly the first time, saving time and costs associated with rejects. It utilizes a high-speed vacuum equipment to ensure quick, reliable placement. It also has the ability for multiple head configuration for parallel processing and increased production speeds. The system is self-diagnostic and can easily detect any errors or faults at any time. It also has an advanced control interface which makes it easy to set up and monitor the unit with minimal training. This intuitive interface allows users to quickly adjust operations parameters and monitoring any potential problems. 7200 Plus is designed to solder a wide range of components and substrates, including thin-film components and substrates, with its integrated heated vacuum chucks, heaters and plated heat conductors. The bonder is also capable of reflowing existing solder in order to adjust and redirect trace and repair broken equipment, thus reducing costly rework time. For custom bonding requirements, ORTHODYNE 7200 Plus offers automated in-situ realignment, ensuring precise placement and a reliable, tight bond even under the most trying circumstances. This realignment machine also helps to reduce lost time associated with setup and production changes, making the tool highly efficient and reducing material costs. 7200 Plus also includes a temperature responsive laser to fine-tune the alignment of components during the reflow process. This laser takes into account the thermal parameters and phase shifts associated with soldering, enabling ORTHODYNE 7200 Plus to bond components swiftly and accurately. 7200 Plus is a reliable bonder with sophisticated features such as self-diagnostics, precise realignment, and temperature responsive laser. This bonder has the ability to meet demanding production requirements while producing strong, reliable bonds at a fraction of the cost. It is an ideal choice for any manufacturing environment that requires reliable, high-volume bonding.
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