Used ORTHODYNE M 20B #293764003 for sale

ORTHODYNE M 20B is a fully automated bonder developed for high-precision applications in the semiconductor and electronics industries. This machine is designed for reliable bonding of small components and can be used for a broad range of applications, such as ball bumping, fine wire bonding, and chip on flex assembly. M 20B allows for high-precision register control and is capable of extremely precise registration of the bonding process. This machine provides users with the ability to easily modify and adjust the process parameters, including wire feed meander and loop size, by utilizing an intuitive UI within the built-in software platform. The machine's built-in image processing system provides precise guidance and control by visually recognizing the components to be bonded. ORTHODYNE M 20B utilizes a highly compact two-axis motion platform to achieve a high-speed, reliable bonder. It uses a stepped motor that is designed to provide precise movement at speeds of up to 8 m/sec. The core optical system utilizes high-end lenses with a formidable dynamic range for high-precision alignment and bonding of micro components. The machine is also equipped with a cycle time monitor, which allows users to quickly and easily review and adjust cycle times and parameters. M 20B is housed in a robust cabinet that includes an interactive control terminal. This terminal features a numeric keypad and LED status indicators for quick and easy navigation of the machine's features. In addition to the console, the machine also includes an emergency stop button. Overall, ORTHODYNE M 20B is a reliable and accurate machine designed for a broad range of precision bonder applications. With its intuitive user interface and powerful algorithms, it easily meets the demanding demands of the modern electronics industry. The high-speed optics and motion system enable fast, low-cost, and high-precision assembly of components, facilitating the production of high-quality products with short cycle times.