Used ORTHODYNE M 20B #293793858 for sale
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ID: 293793858
Vintage: 2007
Wire bonder
Size: 4 to 25 Mils
Type: Aluminium
Feed angle: 45°
Feed capillary
NIKON Stereo zoom microscope
(10) Eyepieces
E-arm type
Bonding head
Bonding tool
Base assembly
Ultrasonic generator: 25 W
Logic control package
ULTRASONIC Transducer
Manipulator: 5:1
Wire spool holder
Microscope mounting
Arm
Illuminators
Manuals
Transformer: 115/220 V
No PC
2007 vintage.
ORTHODYNE M 20B is a state-of-the-art bonder that is a highly accurate and reliable device used in the electronics manufacturing industry. This bonder is specifically designed to be user friendly, so operators can quickly and easily setup and use it with minimal effort. This bonder features a precision-engineered double-rail linear actuator equipment that provides a high accuracy and repeatability for bond joint positioning and height adjustment. It is designed for repeatable, reliable and accurate bond formation. Additionally, M 20B offers an easy to use, high power RFID technology that enables easy and fast operator authentication. The device includes an adjustable laser module, with an adjustable and lockable laser insert. This allows operators to set their desired point of laser-activation, ensuring fast and accurate bonding of the component/s. Additionally, ORTHODYNE M 20B includes a patented tilting head and wide pneumatically actuated die holders. These enable better accuracy and faster bonding of component/s under varying alignment conditions. The device also includes a protective laser system, which reduces the chance of component damage or component distortion. The device's proprietary patented Peel Test feature provides fast and easy verification of the integrity of the bond joints. M 20B also offers a wide range of temperature, up to 200 degrees Celsius, and speeds, from 0.095 to 10,000 cycles per second, for fast bonding of different component types. ORTHODYNE M 20B is designed for long-term use, with a rugged build that makes it highly reliable and durable. It also features a highly efficient cooling unit, ensuring proper temperature conditioning of the union area during operation. The device is also equipped with an innovative bonding quality monitoring machine, to ensure optimal performance and product quality. Overall, M 20B is an excellent choice for operators who require accurate and reliable bonding of components in the electronics manufacturing industry. It offers a highly efficient tool, flexible functionality and user-friendly operation, making it ideal for fast and efficient production of high-quality bond material.
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