Used ORTHODYNE M 360C #293594790 for sale
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ORTHODYNE M 360C is a fully automated high-speed, programmable bonder, designed to meet the most exacting requirements for high-precision, multi-point and multi-head bonding applications. This advanced equipment offers superior precision and reliability, with high processing speeds and quality assurance. ORTHODYNE M360C features four programmable, high-performance bonding heads, with an integrated camera for precise positioning in 3D applications. The unit also includes precision vacuum alignment, vacuum pick-up systems along with touch-down die bonders for all your assembly requirements. The integrated control systems offer optimal efficiency and user-friendly operation, with a simple and intuitive graphical user interface (GUI). M360 C is ideal for a wide range of applications, such as precision die-bond, fine-pitch, wire-bond and ribbon bonding. The system utilizes high-precision machined components and an advanced motion control unit, ensuring that all the bonds are made with absolute accuracy at high speeds. An optional camera scan machine allows the user to precisely monitor the process and detect any anomalies in the bonding materials or their connection. ORTHODYNE M360 C utilizes state-of-the-art microcontroller technology, programmable resolution, a multitude of bond-process settings and vacuum-assisted alignments. The tool is designed to provide repeatable, seamless production and superior yield, providing an excellent return on investment. M 360C is designed to deliver maximum compatibility with all current manufacturing requirements. The asset supports multiple materials and processes, and meets the highest accuracy and quality standards. The modular architecture, servo-driven design and superior drive and speed performance ensure high stability and flexibility in production operations. This high-performance machine incorporates the latest in process automation technology. It offers efficient, automated production of high-quality, highly reliable products. M 360 C is an ideal solution for high-volume bonding and assembling requirements.
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