Used ORTHODYNE M 360C #293620154 for sale

ORTHODYNE M 360C is an automated bonder designed for ultra-precision bonding applications. It is capable of achieving high-speed, high-precision assembly with excellent repeatability. The system utilizes an ultra-compact, integrated design with multiple configurations and custom cylinders to optimize process throughput. Utilizing advanced motion control technology, ORTHODYNE M360C provides a highly accurate, repeatable Bonding process with a minimum of setup or calibration. M360 C is designed to bond a variety of materials including bonded wire, nanowires, semiconductors, metals, ceramics, and other materials. ORTHODYNE M 360 C features state-of-the-art bonding head technology to achieve extremely precise and repeatable results. M 360C is equipped with a high-performance bonder head and is capable of producing adhesive bonding applications at up to 1000°C. M 360 C offers a working area of 5" x 5" and can process up to 4" thick substrates or flip-chip bondings. ORTHODYNE M360 C can process bond heads as small as 2µm in diameter, making it ideal for large-area bonding with specialized equipment such as vision systems, photomasks, laser systems, and more. Moreover, M360C can be configured to bond at a variety of speeds, depending on the size and complexity of the application. ORTHODYNE M 360C offers the flexibility to integrate custom software and hardware to meet the requirements of virtually any application. With its advanced heating and cooling capabilities, ORTHODYNE M360C is suitable for demanding applications that require rapid adhesion of components. This feature ensures that the bonded material maintains its structural integrity and reliability. In addition, M360 C includes a temperature control that ensures maximum process accuracy and repeatability. ORTHODYNE M 360 C is an ideal solution for a variety of high-precision bonding applications. Its multi-configuration capabilities, integrated design concept, and advanced motion control technology make it an excellent choice for meeting the stringent requirements of today's challenging applications.