Used ORTHODYNE M 360C #293629612 for sale

ORTHODYNE M 360C Bonder is a highly advanced bonding equipment. It is designed for manual or automated operations. It is capable of providing reliable bond performance of a wide range of applications, including semiconductors, multilayer ceramic capacitors, heterostructures and ferrite components. ORTHODYNE M360C features a modular design, allowing it to be easily constructed, expanded, and upgraded. The system is designed to provide compatibility with a wide range of bonder tooling which enables a variety of bonding processes, including wire wedge bonding, wedge bonding, ball bonding and die bonding. M360 C features a large interactive LCD touchscreen display, stereo microscope and improved motion capabilities. The motion of the bonder is controlled via a vibration-isolated servo drive, ensuring precise and accurate movements. As well, the unit includes step-up and step-down capability for wire looping, and melting and curing of epoxy. M 360 C provides a compact and efficient package with adjustable bond force for producing perfect bonds in almost any size or shape. The bonder meets industry standards for safety and reliability, using low voltage control circuitry and a laser arrester to prevent damage from fire hazards. ORTHODYNE M360 C is capable of producing highly reliable bonds quickly and accurately. It includes fully programmable features, including an integrated thermal printer, auto-centring, auto-indexing, auto-calibration and auto-diagnosis. These features help ORTHODYNE to ensure consistent bond quality and provide accuracy of ±0.002mm. M 360C is an efficient, flexible and precise machine for the precise bond processing of a wide range of materials. It is designed to provide enhanced process capabilities, superior bond quality and increased productivity. With its unique design, flexibility and reliable performance, ORTHODYNE M 360 C is an excellent choice for the manufacture of precision electronic components.