Used ORTHODYNE M 360C #293679658 for sale

ORTHODYNE M 360C is a bonder, or high-temperature die bonder, which is designed for quick, accurate and highly repeatable bonding of semiconductor dies, leadframes, and other electronic components. The 360C utilizes a unique convective offset preheat technology to evenly heat components prior to bonding. This preheat chamber is equipped with four preheat zones, allowing for up to four independent heating cycles for different components. It features a modular bond head design, enabling easy switching for different bonding methods, with a range of optional heads to accommodate different wire types and sizes. For higher accuracy and repeatability, ORTHODYNE M360C is equipped with a closed-loop force control system, which enables the user to adjust the force to a predetermined value with high precision and repeatability. The 360C has an integrated optical microscope system and automated die-recognition camera, allowing for easy alignment of components. The system also has a total of three axes of motion, facilitating easy adjustment of the workholder and substrates. With its compact design and easy to use touch-screen interface, the 360C is an ideal choice for applications requiring precision and repeatability, such as die and leadframe wire bonding, tab and ribbon bonding, and more.