Used ORTHODYNE M 360C #293818041 for sale

ORTHODYNE M 360C is an automatic high-performance bonder designed for the production of microelectronic and optoelectronic devices such as semiconductors, optoelectronic chips, and printed circuit boards (PCBs). The bonder utilizes its advanced precision bonding equipment and state-of-the-art software to provide excellent fine pitch and small size bonding with accuracy and reliability. The bonder is composed of three main components: an independent motion board, an independent fine pitch motion board, and a power supply. The motion board is an independent motor-driven system that allows properly spatial regulation of an attached tool module. The fine pitch motion board is capable of enhancing the accuracy of automated operation. The power supply supplies the bonder with its high-voltage power in order to execute the bond processes. The bonder is very easy to operate and its intelligent software unit allows the user to set the bond parameters according to the desired process. The machine can be programmed for speed, preheat, and pressure control, depending on the type of job to be performed. The optimal bond process can then be adjusted according to the materials being used and the size and shape of the device being bonded. The bonder operates with a wide range of bond materials such as copper, nickel, gold, and silver, and is also compatible with a wide range of substrates and dies. The bonder can also accommodate various types of bond pins, including gold and alloy-plated pins. The optional heat sink is capable of dissipating the heat generated during the bond process, ensuring a clean and smooth finish to the bond. The bonder also features a built-in laser detector that detects and identifies small defects during the assembly process, greatly reducing the chances of faulty products. The user-friendly video display also allows the operator to monitor the entire process and pinpoint locations that may require more attention. With minimal training, ORTHODYNE M360C is extremely easy to use and provides an excellent bonding quality, even at very small sizes. This makes it ideal for industries such as printed circuit boards, optoelectronics, and semiconductors.