Used ORTHODYNE M 360C #9258804 for sale

ORTHODYNE M 360C bonder is a state-of-the-art bonding tool designed for precision bonding in the electronics assembly. This device is a high-precision, atmospheric pressure, infrared heater based solution for fine-pitch, small-area bonding applications. ORTHODYNE M360C bonder is designed for high precision, high accuracy, repeatable results. It features a compact working area and uses a clean, energy efficient energy source. M360 C bonder is equipped with the latest in bonding technology. Its high efficiency plasma source and advanced infrared focus design allows for high speed operation and minimal heat dissipation, ensuring precise placement and control of the heating elements for maximum heat deposition. M 360C bonder offers a wide variety of waveforms, ensuring tight control of the energy delivery to the substrate. M 360 C bonder also features an advanced interface for controlling the heating elements. Its user-friendly software is easy to use and allows for numerous settings, such as temperature limit, withstand limit, reflow delay, and energy delivery profile. A variety of power sources, including 12V, 24V, and 48V are available. In addition to the sophisticated features it possesses, ORTHODYNE M360 C bonder also has an advanced built-in temperature measuring system. This system measures various points on the heating element to ensure proper heat distribution and accurate bonding. Additionally, the built-in temperature monitor logs all process data to ensure precise process monitoring. M360C bonder also offers an extended temperature range. It is designed to operate in temperatures from -20°C to +230°C and is capable of reaching a maximum of 340°C, making it suitable for even the most demanding of bonding applications. Additionally, it features an alarm and tripping system, which will notify users if the temperature reaches a range outside of its designated parameters. ORTHODYNE M 360 C bonder is an excellent choice for anyone looking for a reliable, high-precision, and energy-efficient device for their bonding needs. With its advanced features and user-friendly design, it is the perfect tool for any electronics assembly.