Used ORTHODYNE M 360C #9312340 for sale

ORTHODYNE M 360C is a fully automated bonder designed for high-volume production operations in the electronics and optoelectronics industries. It is designed to accurately and repeatably bond a wide variety of materials, including metals, plastics, and ceramic substrates. ORTHODYNE M360C is a fully automated system that includes a central controller, robotic arm, vacuum chamber, imaging unit, and process chamber. The central controller, accessible through a touch screen interface, allows users to control the system by selecting from a list of bonding processes, materials, and substrates. The robotic arm is used to fetch, align, and position the substrate for the bonding process. The vacuum chamber is used to heat and pressurize the substrate prior to the bonding process. The imaging unit captures detailed images of the substrate from multiple angles and uses them to create a three-dimensional model of the substrate for use in aligning the substrate correctly during the bonding process. Finally, the process chamber is used to apply the correct force onto the substrate to ensure that the bond is formed securely. M360 C is capable of bonding substrates with a diameter of up to two inches and with a thickness of up to four millimeters. It is also capable of bonding substrates together with a variety of materials, including copper and silver. Furthermore, ORTHODYNE M360 C is capable of bonding rigid and flexible substrates, and can be configured for adhesive or conductive bonds. Additionally, M360C is capable of accurately monitoring the pressure, temperature, and duration of the bonding process for each individual procedure. ORTHODYNE M 360 C has been designed for high-volume production, and can process up to 250 parts per hour. Furthermore, it is capable of handling multiple simultaneous jobs, allowing for a short turnaround time. The system is highly user friendly and has a minimal learning curve, making it easy to integrate into existing production lines. Overall, M 360C is an advanced, highly automated bonder suitable for high-volume production applications in the electronics and optoelectronics industries. It is designed to be user friendly and to be able to quickly and accurately bond a wide variety of substrates together with a variety of materials.