Used ORTHODYNE M 360C #9364724 for sale

ORTHODYNE M 360C is a high-precision surface mount soldering and bonding machine designed for use in high-volume manufacturing and assembly operations. The machine is capable of producing highly accurate and reliable bond connections in a variety of materials, including metals, plastics, and ceramics. ORTHODYNE engineering team has developed a proprietary soldering algorithm for use with ORTHODYNE M360C which is designed to achieve the highest levels of accuracy and consistent performance in the industry. The robust software and hardware systems of the machine ensures repeatable performance and provides built-in diagnostics to identify problems while the process is still in progress. M360 C is outfitted with an advanced 3-axis robotic arm that is designed to provide precise and accurate motion. The machine is capable of performing soldering and bonding operations with maximum precision. The robot arm is designed to accommodate multiple PCBs, up to eight in a single operation. ORTHODYNE M 360 C is capable of up to 4500 bonds per hour and is designed to handle up to 100 mil components, including single- and double-sided solder paste deposition. The machine is also equipped with an auto-feeder that supports continuous feeding for up to ten components and an auto-offline feeder for manual loading. The machine is designed to comply with the requirements of the automotive industry and is designed to meet IPC class 2/3 requirements. M 360 C is also fully compatible with automated conveyor systems and is designed to operate reliably in harsh manufacturing environments. The machine's robust electronic control systems are capable of managing dynamic temperature, pressure, and time regulation profiles, allowing for full control over binder material and weld profile. The system is also equipped with automatic shutoff and recovery functions, which are designed to achieve high throughput from start to finish. ORTHODYNE M360 C is an advanced solder and bonding system that is designed to provide maximum flexibility, accuracy, and performance in a variety of industries and applications. The bonding platform is designed to adhere to rigorous industry standards and provide superior quality in a reliable and cost-effective manner.