Used ORTHODYNE M 360CHD #9185316 for sale

ORTHODYNE M 360CHD is a high speed bonder designed specifically for assembling and bonding semiconductor devices. This state-of-the-art bonder is built to meet the demands of rapid-fire production lines used in the modern semiconductor industry. ORTHODYNE M360 CHD uses a powerful infrared drive equipment and proprietary software to accurately control the temperature profile during bonding operations. This helps ensure a perfect, high-speed bond at every stage of production. M360C-HD has a custom-built user interface that allows for rapid switching between different bond settings and configurable parameters. This user interface is conveniently designed with a large LCD touch-screen display, allowing operators to quickly adjust settings and monitor progress. In addition, this bonder has an intuitive job library that makes it easy to create, store, and recall precise pre-programmed settings for production runs. M 360CHD also features an isolated I/O control panel, allowing for precise control of I/O signals and switching of external I/O devices. This I/O control panel also assists with automated changeovers between bond settings and process jobs. Furthermore, M360 CHD includes a large self-teaching pre-assessment program, which helps to quickly assess new devices, and better understand their bond parameters. ORTHODYNE M360C-HD is designed with a reliable, high-speed bonding technology, which ensures that the bonds created by it are robust and consistent. This technology helps deliver reliable bonds with low thermal fatigue. Furthermore, ORTHODYNE M 360C-HD also has an auto-zeroing system with adjustable compensation parameters to consistently guarantee zero offset even after continuous operation. This unit has variable compensation values, which help guarantee precision in both orientation and location accuracy. M 360C-HD includes the universal "Micro-Innovation" chuck that adapts quickly to almost any type of semiconductor component. This versatile chuck allows it to hold components in both standard and non-standard formats, for bonding with all standard and unusual substrates. This universal chuck also minimizes the stress on components during the bonding process. In addition, ORTHODYNE M 360CHD is equipped with a high-powered jetting machine, which is designed to deliver fast and accurate metallization to thin film wafers. This tool allows for fast, repeatable metallization of wafers at high throughput speeds, with high accuracy and repeatability. Overall, ORTHODYNE M360 CHD is a powerful and precise bonder, designed specifically for the demands of the modern semiconductor industry. This bonder's advanced technology and features make it ideal for assembling and bonding devices with precision, speed, and reliability.