Used ORTHODYNE M 7200 #293748639 for sale

ORTHODYNE M7200 bonder is a precision, high capacity die bonder for automated bonding of electronic components into printed circuit board assemblies. ORTHODYNE M 7200 is built on an advanced, microprocessor-controlled platform that enables fast, accurate and repeatable bonding of high density components, especially on the finest pitch designs. The advanced control equipment allows for the execution of complex and intricate bond patterns, and its modular design allows for a range of additional tooling and automated feeders. Additionally, the machine provides superior probe location accuracy and repeatability. M7200 has a fully self-adjusting, closed-loop control system that allows for maximum production outputs and quick reaction to changes in device sizes or condition. M 7200 is capable of bonding a range of devices such as LED chips, ICs, resistors and other electronic devices, making it the ideal tool for automated assembly of multi-functional electronic components and assemblies. The machine features an advanced laser-guided recognition unit that can accurately identify components, ensuring proper placement and alignment of components. The .6 to 6 mm small pitch devices can be reliably bonded securely with its high-speed, single-point process. ORTHODYNE M7200 also offers improved accuracy due to its dedicated vibration reduction machine and thermal management module, reducing thermal stress and ensuring reliable bonding process. Additionally, the microprocessor-controlled tool supports self-consistency checks, preventing waste due to incorrect operation or programming errors. ORTHODYNE M 7200 also features a built-in Auto-Cal asset for automatic maintenance for the die bonder and pick-and-place head. This maintenance model can reduce chip damage caused by aging and over-heating, and improve placement accuracy. Additionally, the machine includes a user-friendly graphical interface, making it easy to operate and program. M7200 is the most cost-effective, automated die bonder available today, offering superior accuracy and throughput for electronic components and assemblies in a wide range of applications.