Used ORTHODYNE M 7200 #293769073 for sale

Manufacturer
ORTHODYNE
Model
M 7200
ID: 293769073
Bond heads.
ORTHODYNE M7200 is an advanced automatic wire and component bonder designed for high-end industrial and laboratory applications. It is ideally suited for bonding of medical devices, optoelectronic components, and various specialty components in circuit boards. ORTHODYNE M 7200 is a versatile, high-precision bonding platform with the latest in control algorithms, control software, and user-friendly operation technology. M7200 is a robust, modular bonding system designed to meet the needs of industrial applications such as medical devices, optoelectronic components and other specialty components that require precision and repeatable performance. It includes a variety of electrode support mechanisms to address a range of device sizes and shapes. M 7200 is also capable of performing a large variety of bond techniques, including micro-sized flip-chip bonds, lead-to-lead (L2L) bonds and die-attach bonds. The core of ORTHODYNE M7200 is the control system. It is designed around a powerful and easy-to-use graphical user interface (GUI). Through it, operators can easily program and manage bond parameters such as force levels, bond speed, and temperature to obtain reliable and repeatable performance. It also enables the user to quickly adapt to changing application requirements. In addition, ORTHODYNE M 7200 provides an intuitive, self-programmable user interface that enables the operator to quickly and easily establish the bond process. M7200 utilizes the latest in control algorithms and integrated motion technology to facilitate high-precision, high-speed bonding. It offers a variety of powerful software components such as pre-programmed force parameters, automated and manual approaches to controlling the bond speeds, and integrated thermal control systems to ensure quality bonds and achieve repeatable results. M 7200 also includes various safety features, such as pressure limiters, energy monitors and automatic power shut off. This advanced bonder is equipped with sophisticated network communications and a built-in process database to enable remote monitoring and control. Additionally, ORTHODYNE M7200 incorporates a range of editable recipes that make it suitable for a variety of substrates and applications. Overall, ORTHODYNE M 7200 is an ideal choice for applications requiring high-precision with repeatable results, such as those found in medical device and optoelectronic components. Its innovative control algorithms, integrated motion, built-in software and safety features, and advanced networking capabilities provide users with an automated and flexible bonding process.
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