Used ORTHODYNE M360C-DH #9299695 for sale

ORTHODYNE M360C-DH is a precision bonder designed for microelectronic applications. It offers the highest quality of assembly, with precise and repeatable results for a variety of substrates and components. It uses the latest in laser and ultrafast imaging technology to provide fast and accurate bonding with a high degree of accuracy and reliability. M360C-DH uses a combination of laser ablation, optical shorts, and heat staking to deliver superior results. The process begins with laser ablation, where a high-power laser beam ablates the top layer of the solder mask. This creates an optically transparent surface that can be scanned and imaged by ORTHODYNE ultrafast imaging equipment. This system captures individual frames of the substrate and generates precise images that are used to guide the alignment and placement of components during the assembly process. ORTHODYNE M360C-DH uses a three-stage alignment mechanism, allowing the operator to precisely control the angle and placement of each component. The three stages are torsion, rotation, and tilt. Torsion rotation allows the part to rotate and tilt from the plane of the board, while tilt allows the part to spin and rotate around its own axis. This ensures maximum accuracy and repeatability of each component placement and alignment. One of the key features of M360C-DH is its ability to bond different substrates and components together. Its fully programmable settings allow it to easily bond metals, polymers, and ceramic components to various substrates. The unit can perform a variety of bonding jobs on single and multiple layers of material, allowing for a wide variety of applications. ORTHODYNE M360C-DH also includes a range of safety features to help protect the operator from exposure to harmful radiation generated during the bonding process. It comes with a shielded enclosure to help keep all components and bonding materials away from the operator, and an emergency shut off should any process get out of control. M360C-DH is a highly reliable and versatile bonder, offering superior results for a wide range of microelectronic applications. Its precision alignment machine and ability to bond multiple substrates and components result in consistent and reliable results, making it an ideal tool for microelectronic assembly.