Used ORTHODYNE M360C-DH #9299709 for sale

ORTHODYNE M360C-DH is a bonder designed for the production of extremely fine detailed wire bonds in the semiconductor industry. It is capable of precise and repeatable wire bonding operations on all types of packages, including ceramic TAB, fine pitch BGA, QFP, CSP and U-BGA. With a maximum wire length of 6.15mm and a minimum of 0.05mm, the bonder can accommodate devices with tight space requirements. M360C-DH is a fully automated equipment with a highly repeatable degas unit, which ensures optimum degas cycles and rapid lead-free wire bonding processes. The system offers the latest in automated wire bonding technology, with a fully programmable, touch-screen control panel to easily adjust bond parameters for a variety of applications. ORTHODYNE M360C-DH is also designed with an automated cassette to cassette service, allowing for fast and efficient wire bonding operations with no operator intervention. M360C-DH also features a high-speed bonding head for fast and accurate bonding operations. This bonder has an integrated Vision Unit that monitors the entire process, ensuring low scrap and production cost. The Vision Machine is designed to detect shorts, opens, and improper bonds using a variety of parameters. ORTHODYNE M360C-DH is an ideal choice for the applications where precise and repeatable wire bonding processes are critical. It has been designed to meet the exacting tolerances of today's leading semiconductor manufacturers.