Used ORTHODYNE M360C-DH #9299715 for sale

ORTHODYNE M360C-DH is a precision die bonding machine used in the assembly of semiconductor devices. It is well-suited for applications that demand a high degree of accuracy and repeatability, such as the assembly of optoelectronic components, radio frequency (RF) circuits, and advanced semiconductor packages. M360C-DH utilizes a state-of-the-art 4-axis robot controlled micropositioning system, with robot arms capable of full x, y, z, and theta positioning. It is equipped with a high-resolution video camera that is used to create a magnified view of the work area, allowing for precise manipulation and placement of components. ORTHODYNE M360C-DH is capable of working with multiple die sizes, packages, adhesives, and substrates, and offers a variety of programmable options for accuracy and repeatability. It is equipped with an advanced uniform-temperature hot-stage heater, which provides precise thermal control for die attach. This makes it ideal for processes that require a high degree of accuracy and uniform heating for each individual package. It also comes with built-in process control software, which records and stores process information during idle and running periods. M360C-DH is highly flexible, and can be customized to meet specific customer requirements. It has a wide range of processing options, including epoxy, conductive epoxy, and flip-chip. It has user-selectable processing parameters, including temperature profiles and time settings, and an adjustable work stage that provides a range of angles and heights for precise device alignment. It also features a built-in vision system, with high modulation contrast illumination, which allows for precise alignment during the die attach process. ORTHODYNE M360C-DH is a reliable and accurate machine for precise die-bonding processes. It has the ability to process an extensive range of components with a high degree of precision, repeatability and uniformity, and its wide range of process options and adjustable settings offer maximum flexibility. Its innovative built-in vision system provides the accuracy required for repeatable device attachment. M360C-DH is an ideal choice for high-volume die-bonding operations, and its advanced design makes it suitable for a wide range of semiconductor applications.