Used ORTHODYNE M360C-DH #9299731 for sale

ORTHODYNE M360C-DH is a fully automated die-attach bonder designed for high-volume manufacturing applications. It provides precision wire bonding and thermocompression die attach and is capable of bonding a wide range of die sizes and packages. M360C-DH is equipped with a high-speed servo motor and three-axis positioning equipment that enables smooth, repeatable motion with excellent control of XYZ axis movements. An intuitive user interface allows easy system setup and control. Its open platform intelligence enables peak performance over the bond cycle. The advanced bond head control in ORTHODYNE M360C-DH enables bonding of complex packages and bond geometries with precision and repeatability. The unit's wire bonding capabilities support the latest array substrate packages, including Flip Chip, MMCM, and LGA Packages. Its die attach capabilities support die sizes up to 25mm with spacing from 0.8mm to 5mm. In addition to fine pitch wire bonding and die attach, M360C-DH offers significant process control capabilities. Sensors installed in the bond head measure and control parameters such as bond force, bond location, and leg sweep angles to ensure optimal bonding. The machine also offers real-time feedback of the process conditions, helping ensure optimal process results. ORTHODYNE M360C-DH's built-in load cell monitors for spline or U-bend wire feed speeds and security against wire breakage and shorting. With the ability to store up to 500 program recipes, programming and setup time can be significantly reduced. M360C-DH is designed to meet the needs of high-volume bonder requirements, and provides advanced capabilities in a small form factor that is easy to configure and operate. With its advanced motion control, bonding capabilities, and process control features, ORTHODYNE M360C-DH is a reliable and efficient tool for high-volume die attach and wire bonding.