Used ORTHODYNE MO-20 #9374873 for sale

ORTHODYNE MO-20 is an automated hot wire based wire bonder that is designed to provide reliable and repeatable wire bond interconnects in a wide variety of products, ranging from semiconductor integrated circuits to medical devices and frequency control components. MO-20 features an intuitive and user-friendly interface and requires minimal operator training. ORTHODYNE MO-20 is equipped with an auto-tracking CCD camera to ensure precise bonding of wires and an integrated vision equipment to overcome tolerance build-up in the system. It can quickly and easily bond all wire types, including gold, aluminum, and copper. MO-20 is capable of processing multiple loop bonds, multiple types of wire, and double point bonding. The SmartFeed unit allows for quick and precise looping and tension control. ORTHODYNE MO-20 is designed to provide precise control over wire placement, tension, and ball forming. The AutoStitch feature helps create uniform bonds by reducing the risk of overpull and bridging. MO-20 is equipped with an adjustable lay-down bond angle for vertical and diagonal bonding, as well as an adjustable wire tension that creates consistent loops and yield strength. Additionally, the positioning machine provides easy motion control and smooth wire guidance. ORTHODYNE MO-20 can provide a variety of wire bond features such as redundant bonding, thin area coverage, and high looping ratio, for a range of applications. MO-20 meets the demands of high-yield manufacturing, with a high wire bond productivity rate and a low component return rate. ORTHODYNE MO-20 can bond at rates up to 120mm/sec, with the reliability that is necessary in today's production environment. Overall, MO-20 is an automated wire bonder that provides repeatable and reliable bonding with a variety of wire bond options, precise control over wire placement, tension, and ball forming, and a high bond productivity rate. ORTHODYNE MO-20 is a great choice for reliability and yield in a wide range of applications.