Used ORTHODYNE OE7200 #293649710 for sale

ORTHODYNE OE7200 is a high-precision bonder engineered for the semiconductor industry. It is a dual head, all-in-one equipment capable of performing thermocompression and thermosonic gold ball bumping. The system boasts a 20 um placement accuracy, and a repeatability of +/- 5 um, making it ideal for a wide range of bonding applications including lead-free Solder Bonding (SnAgCu) and Aluminum flip-chip joining. Utilizing a unique 4-axis motion control unit, OE7200 is able to independently control critical parameters such as bond force and cycle height, making it a versatile and reliable device for any bonder or assembly line. ORTHODYNE OE7200 bonder is designed with a 12-inch bond arm span for ease-of-use and offers an attractive viewing area for close inspection work, allowing the users to observe the processes and make adjustments during production. It features a full range of bond head options to accommodate different types of materials and substrates. Its advanced thermal management machine, featuring PID proportional control, ensures precise and accurate bonding temperatures. In order to ensure reliable results, OE7200 bonder also comes with integrated process control functions such as process feedback, feed forward, backlash and overshoot compensation, and bond force monitoring. Its patented Blue Beam laser measuring tool accurately measures and records bond heads and bond positions, enabling precise bond head alignment and consistent process quality. ORTHODYNE OE7200 is built with an operator-friendly control asset, equipped with graphical simulation and state-of-the-art I/O interface. All the necessary operation parameters are conveniently and easily adjustable on the machine's intuitive touchscreen monitor. This includes the recipe and parameter selection, as well as the display and management of the operation log. OE7200 also comes with standard-equipped feature recycling and bonding quality data storage, making it easy to conduct maintenance and obtain history logs. Overall, ORTHODYNE OE7200 is a sophisticated and precise bonding device designed for the precise needs of the semiconductor industry. It offers a high bond accuracy, reliable process control, and excellent thermal management. Its intuitive controls and easy maintenance make it a great choice for any bonder or assembly line.