Used ORTHODYNE Wire bonder #293672252 for sale

ORTHODYNE Bonders are mechanical and electrical instruments designed for wire interconnection, tight-loop, and wedge-bonding on bare die, packages, and substrates. ORTHODYNE bonders are designed to meet the needs of semiconductor device makers, semiconductor materials testing labs, and IC design houses. ORTHODYNE bonders provide a fast and reliable platform for gold ball and wire bonding, making them ideal for applications such as flip-chip assembly and test/repair/rework. They feature a wide range of programmable parameters like bond size, bond pitch, bond height, loop geometry, and bondhead/caput velocity, allowing the user to fine-tune their bonding process. ORTHODYNE bonders come with an intuitive graphical user interface with step-by-step icons and user visualization tools. With these tools the operator can quickly configure the bonder for numerous bond sizes and diameters. The bondhead/caput can be configured to select different bondhead/caput sizes for both wire and ball bonding, allowing for fast and efficient bond processing. ORTHODYNE bonders feature a number of specialized wire bonding templates that are designed to reduce the time and cost associated with testing, repair and rework applications. The templates are designed to simplify and speed-up the bonding process. Additionally, ORTHODYNE offers a variety of attachments for the bondhead/caput to suit multiple wire and ball bond types, as well as specialized ball-bonding pads for automated flip-chip assemblies. ORTHODYNE bonders are also designed to work with a variety of accessories such as pre-amplifiers for accurate reading of bond parameters and a vacuum pick-up system for quickly and efficiently picking and placing the wire and ball bond into place. The bonder is also equipped with multiple port closed-loop and open-loop feedback capabilities to provide precise and accurate control over wire and ball bond parameters. ORTHODYNE bonders are an ideal solution for a range of applications, from prototype to production. The flexibility and precision of ORTHODYNE bonders provide a dependable and cost-effective solution for a wide range of wire-bonding needs.