Used PANASONIC FCB-3 #9101052 for sale

PANASONIC FCB-3 is a HD series bonder for high throughput, low cost manufacturing. It is designed to automate the bonding process of semiconductor devices and packaging in a single, efficient equipment. FCB-3 is capable of high speed and precision wire bonding for a wide range of package sizes. It features an advanced control system and an advanced feeder mechanism, which allow for high levels of accuracy and repeatability. The driving force behind PANASONIC FCB-3 is its dual-station wire bonding technique. This technique allows for independent bonding and non-bonding functions on both stations, while still achieving the same wire bond pitch and tolerance. In addition, FCB-3 has a quick wire transfer unit, which ensures high yields by allowing for efficient wire changeover. PANASONIC FCB-3 has a number of advanced features designed to enhance accuracy and throughput. These include a user-friendly touch panel HMI for easy navigation, a variety of advanced vision tools, as well as an automated inspection machine for quickly detecting misalignments and defects. Additionally, the tool is equipped with an array of onboard sensors to monitor process parameters in real-time and a nine-axis robotic arm for easy manipulation. FCB-3 also features a dual-stage gas control asset to assure optimal gas flows and concentrations for more precise bonding results. This model is also equipped with an array of process recipes and can store and execute up to 10,000 programs and recipes. In addition to its advanced features and functions, PANASONIC FCB-3 offers a variety of package types and bonding styles, including traditional, inverted, sequential, and parallel bondings. This makes it suitable for a wide range of applications, including high reliability applications such as automotive and aerospace. The equipment also supports center-wrap and J-bend bonding techniques, while offering the flexibility of both manual and automatic bonding modes. Overall, FCB-3 is an advanced and reliable bonder designed for high throughput and superior results. Its advanced features and functions allow for accurate and repeatable wire bonding, achieving superior yields in a wide range of applications.