Used PANASONIC FCB-D2 #9408519 for sale

Manufacturer
PANASONIC
Model
FCB-D2
ID: 9408519
Flip chip bonder.
PANASONIC FCB-D2 is an advanced high-performance wire bonder designed for use in a wide range of applications. This bonder is capable of making reliable and high-precision bond connections with both gold and aluminum wire, while offering superior control of bond placement accuracy and displacement. The bonder's in-head anti-collision equipment automatically adjusts the head to the correct position during bonding, allowing for greater accuracy as well as production line speeds. Additionally, the wire feeder utilizes cable coils, which allows for multiple lengths of wire to be fed into the bonder for each bond. In order to provide repeatability and reliability, FCB-D2 is equipped with a process monitoring system. This unit includes an angle acquisition unit which measures the motion of the wire and the angle of the wire before and after the bond. The PLC (Programmable Logic Controller) monitors the motion of the wire and the force of the bond head and provides a pass/fail indication for each bond. PANASONIC FCB-D2 features a highly efficient heating machine that is capable of precisely controlling the heat most suitable for each application. This ensures that the maximum amount of heat is applied to each bonding die with minimal power consumption. FCB-D2 offers a precision-positioning tool which makes it easy to achieve excellent bonding results. It also allows for automated operation, with the ability to program and store multiple programs for different wire sizes and shapes. Finally, PANASONIC FCB-D2 includes an upgraded controller that allows for multiple parameters to be adjusted and regulated during the bonding process. This allows for the highest levels of accuracy, speed, and quality. Overall, FCB-D2 is an advanced and highly-effective bonder, offering precise control and high-quality bonding results with both gold and aluminum wire. With its process monitoring asset, efficient heating model, precise positioning equipment, and upgraded controller, this bonder is equipped with the latest in technological advancements, allowing it to accurately and quickly process a wide variety of applications.
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