Used PANASONIC FCB3 #293654339 for sale

Manufacturer
PANASONIC
Model
FCB3
ID: 293654339
Vintage: 2005
Flip chip bonder 2005 vintage.
PANASONIC FCB3 is a high performance, dual lane, fully automatic benchtop wire and ribbon bonder designed to address the needs of the electronic component and semiconductor industries. Using the latest ultrasonic technology, FCB3 offers precision placement accuracy and high cycle rates that help to increase overall productivity. The bonder has two independent bonding areas for placing wire, ribbon and MEC bonds as well as two separate loading areas for specialized materials. A built-in laser alignment system and zoom vision scope assist in precise program placement of wire and ribbon bonds, resulting in improved yields and rejection rates. Its temperature control system ensures that the process temperature is consistently maintained throughout the bonding cycle. TheFCB3 also features a vacuum assisted "Kish" die attach mode for wetting, formation and reliable attachment of those devices. For added convenience and improved repeatability, the bonder comes equipped with multiple program storage and repeat bonded job capability. This helps to eliminate setup time and optimize the first-pass yields when running production batches. User-friendly programming tools, real-time display of process and cycle parameters, as well as advanced diagnostics and traceability features are also available to the operator. The overall design of PANASONIC FCB3 helps make it user-friendly and easy to integrate into any automation system. FCB3 is backed by a wide range of optional accessories, including conveyors, staging systems and workforce management tools, that provide added flexibility and scalability for any production environment. These accessories are also in compliance with the strict safety regulations established by both the National Institute for Occupational Safety and Health (NIOSH) and the Canadian Standards Authority (CSA). PANASONIC FCB3 is a reliable and cost-effective solution for the production of high-quality wire and ribbon bonds. In addition to its robust design, advanced diagnostic capabilities, and a wide range of support accessories, it also provides improved placement accuracy for better yields, improved cycle times for increased throughput and lower environmental impact for sustainability.
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