Used PANASONIC HW27U-H #181703 for sale

Manufacturer
PANASONIC
Model
HW27U-H
ID: 181703
Vintage: 2002
Wire bonder 2002 vintage.
PANASONIC HW27U-H is a bonder ideally suited to applications in the telecom electronics industry. The bonder features a high-precision, full-function wire bonding equipment that is designed for the highest levels of productivity and accuracy. HW27U-H offers a range of features that make it ideal for high-volume, fine bonding applications. It has an ultra-clean wire looping system with an auto-feed pre-feed facility to optimize feed speed. It also features DEK die attachment that ensures the highest levels of accuracy and repeatability, while its auto-splicing cap feeder provides quick and efficient wire splicing and removes the need for human intervention. The bonder is powered by a high-performance motion control unit that enables precision placement and joining of multiple wires in a single cycle. PANASONIC HW27U-H is also capable of accurately placing die and wire bonds on small components as well as handling large, high-volume orders. The high-speed, high-resolution optical machine used by HW27U-H enables fast, accurate placement of die and wire bonds. The bonder is also equipped with a tool that automatically compensates for size variation of components within a single package, allowing for precise and consistent placement of wire bonds. PANASONIC HW27U-H also offers a wide range of options, including a laser wire etching asset, as well as an integrated sorter and optional tool kit. The improved accuracy of the interactive LCD monitor makes it easier to review bond status and analyze information at a glance. The bonder is also equipped with a comprehensive safety model, including double safety start locks and a detection circuit, as well as an automatic emergency stop equipment that prevents damage caused by improper operations. HW27U-H is the perfect solution for applications that require the highest levels of speed, precision, and accuracy. It offers an impressive list of features that enable faster product development and enhanced productivity, making it a top choice for telecom electronics applications.
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