Used PANASONIC HW27U-HF #9251020 for sale

PANASONIC HW27U-HF is a state of the art, dual-head oven bonder specifically designed for board-level microelectronics. It is a powerful tool to help technicians increase yields and reduce costs. It can be used for a variety of applications, including potting, soldering, reflow, wave, conformal coating, and more. HW27U-HF is a full closed loop equipment which allows for precise placement of components and automated temperature control. PANASONIC HW27U-HF oven bonder has a large working area of 27" x 19" and is equipped with dual heads, allowing technicians to work with two boards at the same time. The bonder is capable of accommodating PCBs up to 0.250" thick with component coverage up to 12" on each side. The dual head system also allows for multiple pre-heaters, dispensers, liquid and paste flows, and cooling systems to complete a wide variety of tasks simultaneously, while the programmable labeling ensures accurate and consistent board labeling. HW27U-HF oven bonder comes with an easy-to-use controller with a 10.1" touchscreen, which makes operation simpler and more efficient. This built-in control unit eliminates the need for a foot pedal, which simplifies operation. PANASONIC HW27U-HF oven bonder supports a maximum of 4 soldering heads per oven and can handle temperatures up to 450°C (842°F). The standard SRA plunger machine allows for precise placement of components and the ability to handle various PCB sizes. The board holding clamps ensure that boards are firmly in place while solder paste is dispensed. For increased safety, HW27U-HF has an integrated nitrogen supply as well as a ventilation tool which allows the operator to vent the oven quickly and safely after operation. The oven is also designed to meet all safety regulations, including ESD, Class A and C Safety Standards. The heated area is also framed with insulation to improve user safety. In conclusion, PANASONIC HW27U-HF is a high-precision, high-efficiency dual head oven bonder specifically designed for board-level microelectronics. It has a large working area and is capable of handling parts up to 0.250" thick, with a maximum of 4 soldering heads per oven. It has an easy-to-use controller and integrated safety features to ensure usability and safety in every task.