Used PANASONIC HW27U-HF #9257747 for sale

PANASONIC HW27U-HF is an advanced bonder specifically designed to meet the unique needs of thin film and sub-micrometer chip bonding requirements. It features an electronically-controlled bond-head with an angled rotating head to enable maximum bonding efficiency. The bond head is adjustable in multiple directions for easy adjustment of the bonding angle and force. HW27U-HF is equipped with a high-precision, low-loss stage equipment with an advanced optical encoder that offers superb repeatability and accuracy. The stage is capable of high-speed, precise positioning with a Z-axis range of up to 3.6 inches (90mm). The bonder also features a fully automated, high-resolution vision system for component identification and placement. It supports advanced machine vision application including bin picking, pattern recognition, object shape detection, barcode reading, and part location. The camera is able to achieve an accuracy of ± 1.5mm allowing components to be accurately placed in the bonding head quickly and easily. The machine features a flexible control unit that can be programmed or controlled using any combination of simple text files and dialog boxes. It is also designed to support PANASONIC new custom force curve parameter command. PANASONIC HW27U-HF is further equipped with a unique programmable force control unit which facilitates precise, consistent control of bonding parameters. The machine enables precise control over required bond force, as well as a precision force feedback loop for real-time control over the bond cycle. This tool is designed to provide the finest control of the bonding process to enable superior bond formation and control over other parameters such as the bond length and temperature. HW27U-HF also offers advanced diagnostic features including a high-performance PC/ATX interface and computerized diagnostic software package. Working together, the asset and software provide real-time diagnostics of the bonding process, an error log, and a calibration routine to ensure optimal bond formation. PANASONIC HW27U-HF is designed to meet the demanding requirements of thin-film and sub-micrometer chip bonding applications. It offers precise control over the bonding parameters, advanced vision model, programmable force control equipment, and advanced diagnostic features, making it the ideal bonder for today's demanding manufacturing needs.