Used PANASONIC MDP200-GGI #293608118 for sale

PANASONIC MDP200-GGI is a high-performance wire and ribbon bonder equipped with advanced features and technologies to ensure consistent and reliable bonding results. Its compact, one-piece design minimizes the equipment footprint, enabling a high-density desktop production environment. MDP200-GGI bonder utilizes automated wire and ribbon bonding capabilities, such as ultrasonic wedge, ultrasonic ball, ball hanging, and ribbon welding. The system offers a wide range of wire diameters and materials to bond with, and a maximum range of 0.13 mm-1.6 mm for both wire and ribbon. It also uses a patented pixel recognition feature that allows for fast and accurate placement of strands. The Pixel recognition feature encourages advanced production through its increased accuracy, resulting in wire/ribbon lengths cut to exact specifications and reduced scrap rates. PANASONIC MDP200-GGI also includes a dynamic display that allows operators to monitor and control all aspects of the bonding process. The unit also has advanced diagnosis and troubleshooting capabilities, allowing operators to quickly identify and rectify issues. Additionally, operators have access to a host of features, such as automatic wire peeling, adjustable cycle time, programmable noise reduction, and machine status alarm. MDP200-GGI utilizes a "double-column" positioning machine that allows for the quick placement and removal of different types of bonding elements (e.g. wire, ribbon, etc.). In addition, the wire/ribbon guide mechanism significantly reduces set-up time as well as limits setup and alignment errors. Apart from its automated capabilities, PANASONIC MDP200-GGI also offers manual options for customized production scenarios. Manual editing functions, such as wire length setting, can be easily applied to any sequences. The operator can also program feed rate and micro wire length, for thinner wire applications, to match the specific job requirements. MDP200-GGI is a high-performance wire and ribbon bonder that offers advanced bonding solutions, improved operational efficiency and reliability. With its wide range of automated, semi-automated, and manual functions, the tool meets the most stringent bonding requirements.