Used PANASONIC SW22 #9290419 for sale

Manufacturer
PANASONIC
Model
SW22
ID: 9290419
Wire bonder.
PANASONIC SW22 is a state of the art, dual-channel soldering/desolderingbonder for lead free and high temperature applications. Its compact footprint and automated operation make it an ideal choice for production lines with limited space. The user-friendly interface with X-Y-Z robot navigation ensures quick and precise operation, providing superior repeatability and uniformity. SW22 features a robust construction, featuring a cast iron base and stainless steel frame, to protect against any accidental impacts or shocks. Its full range of temperature control, from 200-450°C (392-842°F), makes it capable of efficient soldering of leaded, lead-free, or high-temperature metals such as gold, silver, and copper. The dual-channel design allows for simultaneous soldering or desoldering of two components at once. Combined with the automatic pressure control, the unit ensures a consistent contact force between all components and the soldering surface, ensuring a reliable and uniform soldering effect. The gas consumption rate is adjustable, and PANASONIC SW22 comes with a pre-set consumption rate suitable for most medium and high temperature point soldering operations. This makes the unit ideal for lead-free and high temperature soldering applications. SW22 is equipped with self-diagnosis and protection functions, as well as a self-detection mechanism to prevent accidents caused by instability in the device components or conditions. Safety functions such as a CO2 sensor and auto shut down are also included. The intuitive design of PANASONIC SW22 optimizes operational efficiency. Its automatic operations and auto needle cleaning sequence minimize setup time, simplify maintenance, and save time. Lastly, an LED lighting system that highlights real-time parameters such as temperature, pressure, and time allows for intuitive monitoring of the process. In conclusion, SW22 is a reliable, precise, and fast dual-channel soldering/desoldering bonder that is designed to facilitate a wide range of medium and high temperature point soldering operations. It boasts a robust construction and advanced operational features, and is well suited for use in production lines with limited space.
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