Used QES ISP-3000 #9404492 for sale

QES ISP-3000 (interdigital systematic placement) is an advanced interdigital bonder developed and manufactured by QES Corporation. ISP-3000 is a high-end interdigital bonder, designed and optimized for manufacturing devices with mixed digital, analog, or RF components. It features an advanced placement equipment that can accurately and quickly place components with a range of sizes and builds. The double-axis gantry system follows the patterns of the component placement, enabling automated and accurate placement of up to 8,000 micro components per hour. Key features of QES ISP-3000 include: Autonomous feature recognition for a variety of component shapes and sizes A double-axis gantry unit for accurate component placement A high component placement speed of up to 8,000 micro components per hour A comprehensive component placement report detailing component placement data An adjustable component height table to support a wide range of component sizes and build types Advanced computer vision technology to align components with high accuracy Automated component placement with no human operator required ISP-3000 is designed to provide a highly reliable and effective component placement solution in manufacturing applications. It has a robust construction, with an overall size of 1420 x 1700 x 2020 mm, allowing it to be easily adjusted to fit different component size and shapes. The double-axis gantry machine enables accurate component placement, generating a component placement report for subsequent analysis. In addition, the fully automated component placement ensures no human errors, reducing downtime and increasing production efficiency. QES ISP-3000 also features adjustable component height tables, allowing for a wide range of component sizes and build types. The component height table is adjustable from .45um to 5.4mm, making it suitable for high-volume component placement in a variety of high-density mixed-signal applications. The advanced computer vision technology of ISP-3000 allows for high-accuracy component alignment, enabling optimal component placement. Overall, QES ISP-3000 is an advanced interdigital bonder designed to enable high-accuracy component placement at high speed. It features an adjustable component height table, robust construction, and advanced computer vision technology, making it suitable for a wide range of manufacturing applications.