Used RESEARCH DEVICES / RD AUTOMATION M-10 #9232946 for sale

RESEARCH DEVICES / RD AUTOMATION M-10
ID: 9232946
Flip chip die bonder, parts machine.
RESEARCH DEVICES / RD AUTOMATION M-10 is an automated bonding tool that is used for wire, ribbon and wedge bonding of semiconductor devices and connectors. RD AUTOMATION M-10 features a highly reliable design for precision alignment and bonding of multiple devices at once. The machine is compatible with virtually any wire material, and it is capable of up to 30 bonds per second to accommodate high-volume production. RESEARCH DEVICES M10 offers a user-friendly interface, with a digital display to monitor parameters and a touchscreen for quick access to all recipes. The machine also has an integrated vision system to ensure correct positioning of the wire-bonding components and a thermal management system to regulate proper temperatures when bonding. In addition, M-10 can be equipped with custom tooling and special accessories to meet specific customer requirements. The system is powered by a control unit with an embedded graphics processor based on Linux operating software. This ensures stable functionality over long periods of time and makes the machine reliable and well suited for complex bonding applications. Furthermore, the machine can be programmed with advanced scripts and integrated with automation equipment, making it suitable for a wide range of production needs. In conclusion, RD AUTOMATION M10 is an automated high-precision bonding machine that offers quality assurance, increased production volumes and user-friendly operation for a wide variety of industries.
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