Used ROYCE 550 #9157295 for sale
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ROYCE 550 is an automated bonder from Lectron Equipment that is used for a variety of wire bonding processes. It utilizes a patented "Flexibloc" technology, which allows for complete freedom of movement when bonding and offers a superior level of flexibility compared to other bonders. The machine is capable of accurately and quickly bonding components to one another at high speed without creating shorts and maximizing efficiency. 550 features a high-precision motion platform, alloy holders for increased accuracy and an integrated parallel-processed control system. The machine is also integrated with a powerful software package that includes both an advanced Bond Sequencer and Alignment Sequencer to ensure accuracy and quality in every bond. Additionally, the bonder utilizes a specialized bond head that has an adjustable clamping range that is adjustable from 0.03mm to 0.12mm. This makes it suitable for almost any type of bonding process, including ball, wedge, wedge loop, wedge tail and even metal-filled bonds. ROYCE 550 also includes an integrated thermal unit that features an advanced heat controller and a graphite heat sink pad. This ensures that there is no overheating during the duration of the bond process. In addition, the unit also has an efficient cooling machine to avoid debonding threats and maintain the exact temperature set by the user. 550 is also designed for a wide range of applications, including flip chip, tape automated bonding (TAB), substrate and die attachments, and more. It offers a high degree of accuracy and repeatability, making it ideal for high-volume production. In addition, the bonder features an intuitive LCD touch-screen control panel with both manual and automatic modes for user convenience. The machine also has numerous safety features such as a built-in interlock, emergency stop switch and access interlock. Overall, ROYCE 550 is an ideal bonding solution for any production environment. The combination of high-precision mechanics, advanced software and integrated thermal systems provide users with an automated bonder that is both efficient and reliable.
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