Used SAMSUNG TECHWIN SFM-8000 #9298734 for sale

SAMSUNG TECHWIN SFM-8000 is an advanced automatic wire bonder used to form electrical connections between components. This bonder is designed to connect fine wires to either chip components, packages, or substrates. It is a highly efficient and precise machine, capable of producing consistently high quality wire bonds. SFM-8000 is a multi-technology wire bonding system, which is compatible with all major bonding methods, such as gold and aluminum wedge, bond, thermocompression, thermocompression gold, and thermowire. It is equipped with an ultra-fine wire bonder, which is capable of forming high quality bonds without sacrificing accuracy or reliability. The bonder also features an advanced wire dispenser, which enables users to quickly and accurately place wires into bonding heads without any manual intervention. The machine is equipped with a range of intelligent features, such as multiple bond force sensors, automatic gain control and force control, and 3D cameras for precise wire alignment. The camera system allows users to accurately control the wire position within the bond area, and is also able to detect wire movement. Additionally, SAMSUNG TECHWIN SFM-8000 allows users to program a process sequence, allowing them to quickly optimize each wire bonding task. Thanks to its reliable and high performance design, SFM-8000 is the perfect choice for a wide range of wire-bonding needs. It enables users to produce high quality and reliable connections, while also saving time and money. Its advanced features and automation make SAMSUNG TECHWIN SFM-8000 an ideal choice for any wire bonding application.