Used SAMSUNG TECHWIN SFM-8000 #9298804 for sale

SAMSUNG TECHWIN SFM-8000 is a state-of-the-art wire bonder designed for high-precision bonding of fine micron-scale bond pads. This fully automated wire bonder is capable of producing up to 8,000 ultrasonic, thermosonic, ball, wedge or ribbon bonds per hour, with a minimum throw distance of 0.5mm. It also has the capability of operating in both static and dynamic modes of bonding, as well as an in-line mode for total automation. It can handle die sizes up to 14 mm x 14 mm, and can generate mechanically-robust and reliable fine pitch and ultra-high density wire bonds. SFM-8000 offers multiple bonding parameters and high stability for both static and dynamic mode of operation. It is equipped with a high-speed, high-accuracy 3-axis X-Y-Θ equipment that is capable of accurately creating 400dpi wires. Its special "over-seat" device ensures reliable wire-bonding, even on ultra-fine pitches of 0.5mm, while its "fast-forward" feature aids in quickly making the correct bond in case of misalignment. Furthermore, SAMSUNG TECHWIN SFM-8000 boasts an ultra-high resolution monitor that can display a wide field of view, allowing the user to easily monitor the entire bonding process. SFM-8000 has an advanced bond monitor system that continuously tracks the bond conditions and can instantly detect any wire-bonding errors. It includes a 6-axis force sensor with five sensing points which provides precise adjustment of sealing and loop completion force. SAMSUNG TECHWIN SFM-8000 also features an advanced thermal and vacuum management unit for dynamic bond mode. This machine maintains a constant Vacuum level and temperature, while also highly stable load stability. SFM-8000 is an adept wire bonder that is capable of performing high-precision, high-speed wire bonding operations with minimal maintenance. Its state-of-the-art features make it a viable wire bonding solution for a wide range of applications. Its versatile design can support both static and dynamic modes of operation, allowing for greater flexibility during operation. It also provides reliable and mechanically-robust bonds, even on ultra-fine pitches of 0.5mm. In addition, its advanced bond monitor tool ensures superior quality control. Its simple design and easy to use interface make SAMSUNG TECHWIN SFM-8000 the ideal choice for any wire bonding task.