Used SAMSUNG TECHWIN SFM2-S #9261812 for sale

SAMSUNG TECHWIN SFM2-S is an advanced, high-performance bonder for microelectronics assembly applications. It features an interchangeable wedge for horizontal or vertical orientation. The bonder is designed with a high-resolution, 3-zone thermal imaging technology that provides precise and accurate processing of a wide range of package types. The major components of the bonder include the Wave Generator, the Laser Head and the Bonding Platform. The Wave Generator is responsible for converting electrical signals into an ultrasonic waves. This is then transmitted to the Laser Head, which contains a calibration lamp and two high-power laser sources. These laser sources generate a focused laser beam that travels through the optics assembly and reaches the Bonding Platform. The Bonding Platform has a large surface area and can accommodate various packages. It has a multi-zone temperature control system that allows the packages to have individual temperatures. The Bonder also boasts a number of industry-grade safety features such as overheating protection, anti-static sensors, emergency stop buttons, and ESD protection. SFM2-S offers superior package control and is a great choice for customers seeking a reliable, high-performance bonder. It can be used in a wide range of industries and applications, including aerospace, medical, automotive, and consumer electronics. It is designed with a high-quality construction and superior technology that allows users to take advantage of maximum product yields and efficient operation. SAMSUNG TECHWIN SFM2-S is an advanced bonder that can handle various microelectronics packages with precise accuracy and speed. It is capable of handling a wide range of temperatures and offers the latest safety features. This bonder is an ideal choice for customers seeking reliable, high-performance production with maximum yields.